Dual nozzle single horizontal fulcrum actuator inkjet

ABSTRACT

An ink jet printhead includes a nozzle chamber having at least two fluid ejection apertures defined in a roof of the chamber; a moveable paddle vane located in a region of a first one of the fluid ejection apertures; an actuator mechanism attached to the moveable paddle vane and adapted to move the paddle vane in a first direction so as to cause the ejection of fluid drops out of the first fluid ejection aperture and to further move the paddle vane in a second, alternative direction so as to cause the ejection of fluid drops out of a second fluid ejection aperture. A method of manufacture of such a printhead comprises initially providing a silicon wafer having a circuitry wafer layer including electrical circuitry necessary for the operation of the actuator mechanism on demand. A trough is etched in the wafer to provide for an ink supply channel through a portion of the wafer. The nozzle chamber, the actuator mechanism and the paddle vane within the nozzle chamber are created on the silicon wafer by means of depositing and etching a series of sacrificial layers to form a supporting structure for the nozzle chamber, the actuator mechanism and the paddle vane, in addition to depositing and suitably etching a series of materials for forming the nozzle chamber including a pair of fluid ejection apertures in a roof of the nozzle chamber, the actuator mechanism and the paddle vane. An ink inlet is etched in the wafer, the inlet being in communication with the nozzle chamber via the ink supply channel extending through the wafer. Any remaining sacrificial layers are etched away so as to release the actuator mechanism and the paddle vane such that the paddle vane is displaceable relative to the fluid ejection apertures for effecting ink ejection from one of the apertures at a time on demand.

CROSS REFERENCES TO RELATED APPLICATIONS

The following Australian provisional patent applications are hereby incorporated by cross-reference. For the purposes of location and identification, US patent applications identified by their US patent application serial numbers (USSN) are listed alongside the Australian applications from which the US patent applications claim the right of priority.

U.S. PAT. NO./PATENT CROSS-REFERENCED APPLICATION (CLAIMING AUSTRALIAN RIGHT OF PRIORITY PROVISIONAL PATENT FROM AUSTRALIAN PRO- DOCKET APPLICATION NO. VISIONAL APPLICATION) NO. PO7991 09/113,060 ART01 PO8505 09/113,070 ART02 PO7988 09/113,073 ART03 PO9395 09/112,748 ART04 PO8017 09/112,747 ART06 PO8014 09/112,776 ART07 PO8025 09/112,750 ART08 PO8032 09/112,746 ART09 PO7999 09/112,743 ART10 PO7998 09/112,742 ART11 PO8031 09/112,741 ART12 PO8030 09/112,740 ARTI3 PO7997 09/112,739 ART15 PO7979 09/113,053 ART16 PO8015 09/112,738 ART17 PO7978 09/113,067 ART18 PO7982 09/113,063 ART19 PO7989 09/113,069 ART20 PO8019 09/112,744 ART21 PO7980 09/113,058 ART22 PO8018 09/112,777 ART24 PO7938 09/113,224 ART25 PO8016 09/112,804 ART26 PO8024 09/112,805 ART27 PO7940 09/113,072 ART28 PO7939 09/112,785 ART29 PO8501 6,137,500 ART30 PO8500 09/112,796 ART31 PO7987 09/113,071 ART32 PO8022 09/112,824 ART33 PO8497 09/113,090 ART34 PO8020 09/112,823 ART38 PO8023 09/113,222 ART39 PO8504 09/112,786 ART42 PO8000 09/113,051 ART43 PO7977 09/112,782 ART44 PO7934 09/113,056 ART45 PO7990 09/113,059 ART46 PO8499 09/113,091 ART47 PO8502 09/112,753 ART48 PO7981 09/113,055 ART50 PO7986 09/113,057 ART51 PO7983 09/113,054 ART52 PO8026 09/112,752 ART53 PO8027 09/112,759 ART54 PO8028 09/112,757 ART56 PO9394 09/112,758 ART57 PO9396 09/113,107 ART58 PO9397 09/112,829 ART59 PO9398 09/112,792 ART60 PO9399 6,106,147 ART61 PO9400 09/112,790 ART62 PO9401 09/112,789 ART63 PO9402 09/112,788 ART64 PO9403 09/112,795 ART65 PO9405 09/112,749 ART66 PP0959 09/112,784 ART68 PP1397 09/112,783 ART69 PP2370 09/112,781 DOT01 PP2371 09/113,052 DOT02 PO8003 09/112,834 Fluid01 PO8005 09/113,103 Fluid02 PO9404 09/113,101 Fluid03 PO8066 09/112,751 IJ01 PO8072 09/112,787 IJ02 PO8040 09/112,802 IJ03 PO8071 09/112,803 IJ04 PO8047 09/113,097 IJ05 PO8035 09/113,099 IJ06 PO8044 09/113,084 IJ07 PO8063 09/113,066 IJ08 PO8057 09/112,778 IJ09 PO8056 09/112,779 IJ10 PO8069 09/113,077 IJ11 PO8049 09/113,061 IJ12 PO8036 09/112,818 IJ13 PO8048 09/112,816 IJ14 PO8070 09/112,772 IJ15 PO8067 09/112,819 IJ16 PO8001 09/112,815 IJ17 PO8038 09/113,096 IJ18 PO8033 09/113,068 IJ19 PO8002 09/113,095 IJ20 PO8068 09/112,808 IJ21 PO8062 09/112,809 IJ22 PO8034 09/112,780 IJ23 PO8039 09/113,083 IJ24 PO8041 09/113,121 IJ25 PO8004 09/113,122 IJ26 PO8037 09/112,793 IJ27 PO8043 09/112,794 IJ28 PO8042 09/113,128 IJ29 PO8064 09/113,127 IJ30 PO9389 09/112,756 IJ31 PO9391 09/112,755 IJ32 PP0888 09/112,754 IJ33 PP0891 09/112,811 IJ34 PP0890 09/112,812 IJ35 PP0873 09/112,813 IJ36 PP0993 09/112,814 IJ37 PP0890 09/112,764 IJ38 PP1398 09/112,761 IJ39 PP2592 09/112,767 IJ40 PP2593 09/112,768 IJ41 PP3991 09/112,807 I142 PP3987 09/112,806 IJ43 PP3985 09/112,820 IJ44 PP3983 09/112,821 IJ45 PO7935 09/112,822 IJM01 PO7936 09/112,825 IJM02 PO7937 09/112,826 IJM03 PO8061 09/112,827 IJM04 PO8054 09/112,828 IJM05 PO8065 6,071,750 IJM06 PO8055 09/113,108 IJM07 PO8053 09/113,109 IJM08 PO8078 09/113,123 IJM09 PO7933 09/113,114 IJM10 PO7950 09/113,115 IJM11 PO7949 09/113,129 IJM12 PO8060 09/113,124 IJM13 PO8059 09/113,125 IJM14 PO8073 09/113,126 IJM15 PO8076 09/113,119 IJM16 PO8075 09/113,120 IJM17 PO8079 09/113,221 IJM18 PO8050 09/113,116 IJM19 PO8052 09/113,118 IJM20 PO7948 09/113,117 IJM21 PO7951 09/113,113 IJM22 PO8074 09/113,130 IJM23 PO7941 09/113,110 IJM24 PO8077 09/113,112 IJM25 PO8058 09/113,087 IJM26 PO8051 09/113,074 IJM27 PO8045 6,110,754 IJM28 PO7952 09/113,088 IJM29 PO8046 09/112,771 IJM30 PO9390 09/112,769 IJM31 PO9392 09/112,770 IJM32 PP0889 09/112,798 IJM35 PP0887 09/112,801 IJM36 PP0882 09/112,800 IJM37 PP0874 09/112,799 IJM38 PP1396 09/113,098 IJM39 PP3989 09/112,833 IJM40 PP2591 09/112,832 IJM41 PP3990 09/112,831 IJM42 PP3986 09/112,830 IJM43 PP3984 09/112,836 IJM44 PP3982 09/112,835 IJM45 PP0895 09/113,102 IR01 PP0870 09/113,106 IR02 PP0869 09/113,105 IR04 PP0887 09/113,104 IR05 PP0885 09/112,810 IR06 PP0884 09/112,766 IR10 PP0886 09/113,085 IR12 PP0871 09/113,086 IR13 PP0876 09/113,094 IR14 PP0877 09/112,760 IR16 PP0878 09/112,773 IR17 PP0879 09/112,774 IR18 PP0883 09/112,775 IR19 PP0880 6,152,619 IR20 PP0881 09/113,092 IR21 PO8006 6,087,638 MEMS02 PO8007 09/113,093 MEMS03 PO8008 09/113,062 MEMS04 PO8010 6,041,600 MEMS05 PO8011 09/113,082 MEMS06 PO7947 6,067,797 MEMS07 PO7944 09/113,080 MEMS09 PO7946 6,044,646 MEMS10 PO9393 09/113,065 MEMS11 PP0875 09/113,078 MEMS12 PP0894 09/113,075 MEMS13

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

FIELD OF THE INVENTION

The field of the invention relates to the field of inkjet printing and in particular, discloses a method of manufacture of an inkjet printhead arrangement including a dual nozzle single horizontal fulcrum actuator inkjet.

BACKGROUND OF THE INVENTION

Many ink jet printing mechanisms are known. Unfortunately, in mass production techniques, the production of ink jet heads is quite difficult. For example, often, the orifice or nozzle plate is constructed separately from the ink supply and ink ejection mechanism and bonded to the mechanism at a later stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)). These separate material processing steps required in handling such precision devices often adds a substantial expense in manufacturing.

Additionally, side shooting ink jet technologies (U.S. Pat. No. 4,899,181) are often used but again, this limits the amount of mass production throughput given any particular capital investment.

Additionally, more esoteric techniques are also often utilised. These can include electroforming of nickel (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)), electrodischarge machining, laser ablation (U.S. Pat. No. 5,208,604), micro-punching, etc.

The utilisation of the above techniques is likely to add substantial expense to the mass production of ink jet printheads and therefore add substantially to their final cost.

It would therefore be desirable if an efficient system for the mass production of ink jet printheads could be developed.

With any inkjet printing arrangement, particularly those formed in a page wide inkjet printhead, it is desirable to minimise the dimensions of the arrangement so as to ensure compact economical construction. Further, it is desirable to provide for energy efficient operation.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide for the manufacture of an alternative form of inkjet printhead including a multi-nozzled arrangement wherein a single actuator is utilised to eject ink from multiple nozzles.

In accordance with a first aspect of the present invention, there is provided a method of manufacturing a dual nozzle single horizontal fulcrum actuator ink jet printhead wherein an array of nozzles are formed on a substrate utilising planar monolithic deposition, lithographic and etching processes.

Multiple ink jet heads are preferably formed simultaneously on a single planar substrate which can comprise a silicon wafer.

The printheads are preferably formed utilising standard vlsi/ulsi processing. Integrated drive electronics are preferably formed on the same substrate. The integrated drive electronics are formed by a CMOS fabrication process.

Ink can be ejected from the substrate substantially normal to the substrate.

In accordance with a further aspect of the present invention, there is provided a method of manufacture of an ink jet printer which preferably can include a nozzle chamber having at least two fluid ejection apertures defined in the walls of the chamber; a moveable paddle vane located in a plane adjacent the rim of a first one of the fluid ejection apertures; an actuator mechanism attached to the moveable paddle vane and adapted to move the paddle vane in a first direction so as to cause the ejection of fluid drops out of the first fluid ejection aperture and to further move the paddle vane in a second alternative direction so as to cause the ejection of fluid drops out of a second fluid ejection aperture, the method comprising the steps of: (a) initially providing a silicon wafer having a circuitry wafer layer including the electrical circuitry necessary for the operation of the actuator mechanism on demand; (b) etching a trough in the wafer to provide for an ink supply channel through a portion of the wafer; (c) creating the nozzle chamber and the actuation mechanism and the paddle vane within the nozzle chamber on the silicon wafer by means of depositing and etching a series of sacrificial layers to form a supporting structure for the nozzle chamber, the actuation mechanism and the paddle vane, in addition to depositing and suitably etching a series of materials for forming the nozzle chamber, the actuation mechanism and the paddle vane; (d) etching an ink supply channel interconnecting the nozzle chamber through the wafer; and (e) etching away any remaining sacrificial layers so as to release the actuation mechanism and the paddle vane for operation.

The step (c) can comprise the steps of: (i)depositing and etching a first series of sacrificial layers to form a first supporting structure; (ii)depositing and etching a first non-conductive material layer to form a first structure including a portion of the nozzle chamber and a first portion of the actuation mechanism; (iii)depositing and etching a first conductive material layer to form a lower heater structure of the actuation mechanism; (iv)depositing and etching a second non-conductive material layer forming a central portion of the actuation mechanism, a portion of the nozzle wall and the paddle vane in addition to a supporting structure for an upper heater structure; (v)depositing and etching a second conductive material layer to form an upper heater structure of the actuation mechanism; (vi)depositing and etching a further third non-conductive material layer so as to form the paddle vane, the nozzle chamber walls and a portion affixing one end of the actuation mechanism to the wafer; (vii)depositing and etching a further sacrificial layer to form a further supporting structure for the nozzle chamber walls; (viii)depositing and etching a further fourth non-conductive material layer forming the nozzle chamber walls and roof in addition to the fluid ejection apertures; (ix)etching an ink supply channel through the wafer for the supply of ink to the nozzle chamber.

The first and second conductive material can comprise substantially a copper nickel alloy and the non-conductive material can comprise substantially silicon dioxide.

The sacrificial layers can comprise substantially glass and/or aluminium.

The steps are preferably also utilized to simultaneously separate the wafer into separate printheads.

BRIEF DESCRIPTION OF THE DRAWINGS

Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:

FIG. 1 shows a schematic side view of an ink jet nozzle of the invention a quiescent state;

FIG. 2 shows a schematic side view of the nozzle is an initial part of an ink ejection stage from a first nozzle opening of the nozzle;

FIG. 3 shows a schematic side view of the nozzle in a further part of an ink ejection stage from the first nozzle opening;

FIG. 4 shows a schematic side view of the nozzle in an initial part of an ink ejection stage from a second nozzle opening of the nozzle;

FIG. 5 shows a schematic side view of the nozzle in a further part of an ink ejection stage from the second nozzle opening;

FIG. 6 is a perspective view, partly in section of one form of construction of the preferred embodiment;

FIG. 7 shows a schematic side view of an initial stage in the manufacture of an ink jet nozzle of the invention and step of etching a CMOS layer and silicon wafer layer;

FIG. 8 shows a step of depositing and etching a sacrificial material layer;

FIG. 9 shows a step of depositing a first layer;

FIG. 10 shows a step of etching the sacrificial material later and the first glass layer;

FIG. 11 shows a step of further etching the first glass layer;

FIG. 12 shows a step of depositing a heater material layer;

FIG. 13 shows a step of depositing and etching a second glass layer;

FIG. 14 shows a step of further etching the second glass layer;

FIG. 15 shows a step of depositing a further heater material layer;

FIG. 16 shows a step of depositing a third glass layer;

FIG. 17 shows a step of etching the third glass layer;

FIG. 18 shows a step of further etching said third glass layer;

FIG. 19 shows a step of still further etching the third glass layer;

FIG. 20 shows a step of depositing a further sacrificial material layer;

FIG. 21 shows a step of depositing a fourth glass layer;

FIG. 22 shows a step of etching the fourth glass layer;

FIG. 23 shows a step of back etching through the silicon wafer layer;

FIG. 24 shows a step of etching the sacrificial material layer;

FIG. 25 illustrates an array view illustrating a portion of a printhead constructed in accordance with the preferred embodiment.

FIG. 26 provides a legend of the materials indicated in FIGS. 27 to 43;

FIG. 27 shows a sectional side view of an initial manufacturing step of an ink jet printhead nozzle showing a silicon wafer and an electrical circuitry layer;

FIG. 28 shows a step of etching the silicon wafer layer and electrical circuitry layer;

FIG. 29 shows a step of depositing and etching a first sacrificial material layer;

FIG. 30 shows a step of depositing and etching a first glass layer;

FIG. 31 shows a step of further etching the first glass layer;

FIG. 32 shows a step of depositing a first heater material layer;

FIG. 33 shows a step of depositing and etching a second glass layer;

FIG. 34 shows a step of depositing a second heater material layer;

FIG. 35 shows a step of depositing and etching a third glass layer;

FIG. 36 shows a step of further etching the third glass layer;

FIG. 37 shows a step of still further etching the third glass layer;

FIG. 38 shows a step of depositing a further sacrificial material layer;

FIG. 39 shows a step of depositing and etching a fourth glass layer;

FIG. 40 shows a step of further etching the fourth glass layer;

FIG. 41 shows a step of back etching the silicon wafer layer;

FIG. 42 shows a step of etching the sacrificial material layers; and

FIG. 43 shows a step of filling the completed ink jet nozzle with ink.

DESCRIPTION OF PREFERRED AND OTHER EMBODIMENTS

In the preferred embodiment, an inkjet printing system is provided for the projection of ink from a series of nozzles. In the preferred embodiment a single paddle is located within a nozzle chamber and attached to an actuator device. When the nozzle is actuated in a first direction, ink is ejected through a first nozzle aperture and when the actuator is activated in a second direction causing the paddle to move in a second direction, ink is ejected out of a second nozzle. Turning initially to FIGS. 1-5, there will now be illustrated in a schematic form, the operational principles of the preferred embodiment.

Turning initially to FIG. 1, there is shown a nozzle arrangement 1 of the preferred embodiment when in its quiescent state. In the quiescent state, ink fills a first portion 2 of a nozzle chamber 4 and a second portion 3 of the nozzle chamber 4. The ink fills the nozzle chamber 4 from an ink supply channel 5 to the point that a meniscus 6, 7 is formed around corresponding nozzle holes 8,9. A paddle 10 is provided within the nozzle chamber 4 with the paddle 10 being interconnected to an actuator device 12, which comprises a thermal actuator which can be actuated so as to cause the actuator 12 to bend, as will be become more apparent hereinafter.

In order to eject ink from the first nozzle hole 9, the actuator 12 is activated so as to bend as illustrated in FIG. 2. The bending of actuator 12 causes the paddle 10 to rapidly move upwards which causes a substantial increase in the pressure of the fluid, such as ink, within portion 2 of nozzle chamber 4 and adjacent to the meniscus 7. This results in a general rapid expansion of the meniscus 7 as ink flows through the nozzle hole 9 as a result of the increasing pressure. The rapid movement of paddle 10 causes a reduction in pressure along the back surface of the paddle 10. This results in general flows as indicated 17, 18 from the second portion 3 of nozzle chamber 4 and the ink supply channel 5. Next, while the meniscus 7 is extended, the actuator 12 is deactivated resulting in the return of the paddle 10 to its quiescent position as indicated in FIG. 3. The return of the paddle 10 operates against the forward momentum of the ink adjacent the meniscus 7 which subsequently results in the breaking off of the meniscus 7 so as to form the drop 20 as illustrated in FIG. 3. The drop 20 continues onto the print media. Further, surface tension effects on the ink meniscus 7 and ink meniscus 6 result in ink flows 21-23 which replenish the nozzle chamber 4. Eventually, the paddle 10 returns to its quiescent position and the situation is again as illustrated in FIG. 1.

Subsequently, when it is desired to eject a drop via ink ejection hole 8, the actuator 12 is activated as illustrated in FIG. 4. The activation of the actuator 12 causes the paddle 10 to move rapidly down causing a substantial increase in pressure in the portion 3 of the nozzle chamber 4 which results in a rapid growth of the meniscus 6 around the nozzle hole 8. This rapid growth is accompanied by a general collapse in meniscus 7 as the ink is sucked back into the portion 2 of the chamber 4. Further, ink flow, as illustrated by arrow 100, also occurs into ink supply channel 5. However, hopefully this ink flow is minimised. Subsequently, as indicated in FIG. 5, the actuator 12 is deactivated resulting in the return of the paddle 10 to its quiescent position. The return of the paddle 10 results in a general lessening of pressure within the portion 3 of the nozzle chamber 4 as ink is sucked back into the area under the paddle 10. The forward momentum of the ink surrounding the meniscus 6 and the backward momentum of the other ink within portion 3 of the nozzle chamber 4 is resolved through the breaking off of an ink drop 25 which proceeds towards the print media. Subsequently, the surface tension on the meniscus 6 and 7 results in a general ink inflow 26 from ink supply channel 5 resulting in the arrangement returning to the quiescent state as indicated in FIG. 1.

It can therefore be seen that the schematic illustration of FIG. 1 to FIG. 5 describes a system where a single planar paddle is actuated so as to eject ink from multiple nozzles.

Turning now to FIG. 6, there is illustrated a sectional view through one form of implementation of a single nozzle arrangement 1. The nozzle arrangement 1 can be constructed on a silicon wafer base 28 through the construction of large arrays of nozzles at one time utilising standard micro electromechanical processing techniques.

An array of nozzles on a silicon wafer device can be constructed utilising semiconductor processing techniques in addition to micro machining and micro fabrication process technology. (MEMS) and a full familiarity with these technologies is hereinafter assumed.

For a general introduction to a micro-electro mechanical system (MEMS) reference is made to standard proceedings in this field including the proceeding of the SPIE (International Society for Optical Engineering) including volumes 2642 and 2882 which contain the proceedings of recent advances and conferences in this field.

One form of construction will now be described with reference to FIGS. 7 to 24. On top of the silicon wafer 28 is first constructed a CMOS processing layer 29 which can provide for the necessary interface circuitry for driving the thermal actuator and its interconnection with the outside world. The CMOS layer 29 is suitably passivated so as to protect it from subsequent MEMS processing techniques. The walls eg. 30 can be formed from glass (SiO₂). Preferably, the paddle 10 includes a thinned portion 32 for more efficient operation. Additionally, a sacrificial etchant hole 33 is provided for allowing more effective etching of sacrificial etchants within the nozzle chamber 4. The ink supply channel 5 is generally provided for interconnecting an ink inlet 34 which can be etched through the wafer 28 by means of utilisation of a deep anisotropic trench etcher such as that available from Silicon Technology Systems of the United Kingdom.

The arrangement 1 further includes a thermal actuator device eg. 12 which includes two arms comprising an upper arm 36 and a lower arm 37 formed around a glass core 38. Both upper and lower arm heaters 36, 37 can comprise a 0.4μ film of 60% copper and 40% nickel hereinafter known as (Cupronickel) alloy. Copper and nickel is used because it has a high bend efficiency and is also highly compatible with standard VLSI and MEMS processing techniques. The bend efficiency can be calculated as the square of the coefficient of the thermal expansion times the Young's modulus, divided by the density and divided by the heat capacity. This provides a measure of the amount of “bend energy” produced by a material per unit of thermal (and therefore electrical) energy supplied.

The core can be fabricated from glass which also has many suitable properties in acting as part of the thermal actuator. The actuator 12 includes a thinned portion 40 for providing an interconnect between the actuator 12 and the paddle 10. The thinned portion 40 provides for non-destructive flexing of the actuator 12. Hence, when it is desired to actuate the actuator 12, say to cause it to bend downwards, a current is passed through the top cupronickel layer causing it to be heated and expand. This in turn causes a general bending due to the thermocouple relationship between the layers 36 and 37. The bending down of the actuator 12 also causes thinned portion 40 to move downwards in addition to the portion 41. Hence, the paddle 10 is pivoted around the wall 41 which can, if necessary, include slots for providing for efficient bending. Similarly, the heater arm 37 can be operated so as to cause the actuator 12 to bend up with the consequential movement upon the paddle 10.

A pit 39 is provided adjacent to the wall of the nozzle chamber to ensure that any ink outside of the nozzle chamber has minimal opportunity to “wick” along the surface of the printhead as the wall 41 can be provided with a series of slots to assist in the flexing of the fulcrum.

Turning now to FIGS. 7-24, there will now be described one form of processing construction of the preferred embodiment of FIG. 6. This can involve the following steps:

1. Initially, as illustrated in FIG. 7, starting with a fully processed CMOS wafer 28 the CMOS layer 29 is deep silicon etched so as to provide for the nozzle ink inlet 5.

2. Next, as illustrated in FIG. 8, a 7μ layer 42 of a suitable sacrificial material (for example, aluminium), is deposited and etched with a nozzle wall mask in addition to the electrical interconnect mask.

3. Next, as illustrated in FIG. 9, a 7μ layer of low stress glass 42 is deposited and planarised utilising chemical planarization.

4. Next, as illustrated in FIG. 10, the sacrificial material is etched to a depth of 0.4 micron and the glass to at least a level of 0.4 micron utilising a first heater mask.

5. Next, as illustrated in FIG. 11, the glass layer is etched as shown at 45, 46 down to the aluminium portions of the CMOS layer providing for an electrical interconnect utilising a first heater mask.

6. Next, as illustrated in FIG. 12, a 3 micron layer 48 of 50% copper and 40% nickel alloy is deposited and planarised utilising chemical mechanical planarization.

7. Next, as illustrated in FIG. 13, a 4 micron layer 49 of low stress glass is deposited and etched to a depth of 0.5 micron utilising a mask for the second heater.

8. Next, as illustrated in FIG. 14, the deposited glass layer is etched as at 50 down to the cupronickel utilising a second heater mask.

9. Next, as illustrated in FIG. 15, a 3 micron layer 51 of cupronickel is deposited and planarised utilising chemical mechanical planarization.

10. As illustrated in FIG. 16, next, a 7 micron layer 52 of low stress glass is deposited.

11. The glass 52 is etched, as illustrated in FIG. 17 to a depth of 1 micron utilising a first paddle mask.

12. Next, as illustrated in FIG. 18, the glass 52 is again etched to a depth of 3 micron utilising a second paddle mask with the first mask utilised in FIG. 17 etching away those areas not having any portion of the paddle and the second mask as illustrated in FIG. 18 etching away those areas having a thinned portion. Both the first and second mask of FIG. 17 and FIG. 18 can be a timed etch.

13. Next, as illustrated in FIG. 19, the glass 52 is etched to a depth of 7 micron using a third paddle mask. The third paddle mask leaves the nozzle wall 30, baffle 11, thinned wall 41 and end portion 54 which fixes one end of the thermal actuator firmly to the substrate.

14. The next step, as illustrated in FIG. 20, is to deposit an 11 micron layer 55 of sacrificial material such as aluminium and planarize the layer utilising chemical mechanical planarization.

15. As illustrated in FIG. 21, a 3 micron layer 56 of glass is deposited and etched to a depth of 1 micron utilising a nozzle rim mask.

16. Next, as illustrated in FIG. 22, the glass 56 is etched down to the sacrificial layer utilising a nozzle mask so as to form the nozzle structure 58.

17. The next step, as illustrated in FIG. 23, is to back etch an ink inlet 34 utilising a deep silicon trench etcher such as that available from Silicon Technology Systems. The printheads can also be diced by this etch.

18. Next, as illustrated in FIG. 24, the sacrificial layers are etched away by means of a wet etch and wash.

The printheads can then be inserted in an ink chamber moulding, tab bonded and a PTFE hydrophobic layer evaporated over the surface so as to provide for a hydrophobic surface.

In FIG. 25, there is illustrated a portion of a pagewidth printhead including a series of nozzle arrangements as constructed in accordance with the principles of the preferred embodiment. The array 60 has been constructed for three colour output having a first row 61, a second row 62 and a third row 63. Additionally, a series of bond pads, eg. 64, 65 are provided at the side for tab automated bonding to the printhead. Each row 61, 62, 63 can be provided with a different colour ink including cyan, magenta and yellow for providing full colour output. The nozzles of each row 61-63 are further divided into sub rows eg. 68, 69. Further, a glass strip 70 can be provided for anchoring the actuators of the row 63 in addition to providing for alignment for the bond pads 64, 65.

The CMOS circuitry can be provided so as to fire the nozzles with the correct timing relationships. For example, each nozzle in the row 68 is fired together followed by each nozzle in the row 69 such that a single line is printed.

It could be therefore seen that the preferred embodiment provides for an extremely compact arrangement of an inkjet printhead which can be made in a highly inexpensive manner in large numbers on a single silicon wafer with large numbers of printheads being made simultaneously. Further, the actuation mechanism provides for simplified complexity in that the number of actuators is halved with the arrangement of the preferred embodiment.

The presently disclosed ink jet printing technology is potentially suited to a wide range of printing systems including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with in-built pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic “minilabs”, video printers, PHOTO CD (PHOTO CD is a registered trade mark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.

One form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:

1. Using a double sided polished wafer 28, complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2 metal CMOS process 29. Relevant features of the wafer at this step are shown in FIG. 27. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. FIG. 26 is a key to representations of various materials in these manufacturing diagrams, and those of other cross referenced ink jet configurations.

2. Etch oxide 29 down to silicon or aluminum using Mask 1. This mask defines the ink inlet hole.

3. Etch silicon to a depth of 15 microns using etched oxide as a mask to form ink supply channel 5. The sidewall slope of this etch is not critical (75 to 90 degrees is acceptable), so standard trench etchers can be used. This step is shown in FIG. 28.

4. Deposit 7 microns of sacrificial aluminum 42.

5. Etch the sacrificial layer 42 using Mask 2, which defines the nozzle walls 30 and actuator anchor 54. This step is shown in FIG. 29.

6. Deposit 7 microns of low stress glass 43 and planarize down to aluminum using CMP.

7. Etch the sacrificial material 42 to a depth of 0.4 microns, and glass 43 to a depth of at least 0.4 microns, using Mask 3. This mask defined the lower heater. This step is shown in FIG. 30.

8. Etch the glass layer 43 down to aluminum using Mask 4, defining heater vias 45,46. This step is shown in FIG. 31.

9. Deposit 1 micron of heater material 80 (e.g. titanium nitride (TiN)) and planarize down to the sacrificial aluminum using CMP. This step is shown in FIG. 32.

10. Deposit 4 microns of low stress glass 81, and etch to a depth of 0.4 microns using Mask 5. This mask defines on upper heater recess. This step is shown in FIG. 33.

11. Etch glass 43 down to TiN using Mask 6. This mask defines the upper heater vias 50.

12. Deposit 1 micron of TIN 82 and planarize down to the glass using CMP. This step is shown-in FIG. 34 and defines upper heater.

13. Deposit 7 microns of low stress glass 83.

14. Etch glass 83 to a depth of 1 micron using Mask 7. This mask defines the nozzle walls 30, nozzle chamber baffle 11, the paddle 10, the flexure, the actuator arm 12, and the actuator anchor 54. This step is shown in FIG. 35.

15. Etch glass 83, as illustrated at 84, to a depth of 3 microns using Mask 8. This mask defines a further part of each of the nozzle walls 30, nozzle chamber baffle 11, the actuator arm 12, and the actuator anchor 54. This step is shown in FIG. 36.

16. Etch glass 83, as illustrated at 85, to a depth of 7 microns using Mask 9. This mask defines final parts of the nozzle walls 30 and the actuator anchor 54. This step is shown in FIG. 37.

17. Deposit 11 microns of sacrificial aluminum 86 and planarize down to glass using CMP. This step is shown in FIG. 38.

18. Deposit 3 microns of PECVD glass 87.

19. Etch glass 87 to a depth of 1 micron using Mask 10, which defines the nozzle rims 88. This step is shown in FIG. 39.

20. Etch glass 87 down to the sacrificial layer 86 (3 microns) using Mask 11, defining the nozzle holes 8 and 9 and the sacrificial etched holes 33, and the nozzle chamber roof. This step is shown in FIG. 40.

21. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.

22. Back-etch the silicon wafer 28 to within approximately 10 microns of the front surface using Mask 12. This mask defines the ink inlet 34 which is etched through the wafer 28. The wafer 28 is also diced by this etch. This etch can be achieved with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems. This step is shown in FIG. 41.

23. Etch all of the sacrificial aluminum 42,86. The nozzle chambers 4 are cleared, the actuators 12 freed, and the chips are separated by this etch. This step is shown in FIG. 42.

24. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply the appropriate color ink to the ink inlets at the back of the wafer.

25. Connect the printheads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.

26. Hydrophobize the front surface of the printheads.

27. Fill the completed printheads with ink 89 and test them. A filled nozzle is shown in FIG. 43. It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiments without departing from the spirit or scope of the invention as broadly described. The present embodiments are, therefore, to be considered in all respects to be illustrative and not restrictive.

Ink Jet Technologies

The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable.

The most significant problem with thermal ink jet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal ink jet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.

The most significant problem with piezoelectric ink jet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per printhead, but is a major impediment to the fabrication of pagewidth printheads with 19,200 nozzles.

Ideally, the ink jet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new ink jet technologies have been created. The target features include:

low power (less than 10 Watts)

high resolution capability (1,600 dpi or more)

photographic quality output

low manufacturing cost

small size (pagewidth times minimum cross section)

high speed (<2 seconds per page).

All of these features can be met or exceeded by the ink jet systems described below with differing levels of difficulty. Forty-five different ink jet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the list under the heading Cross References to Related Applications.

The ink jet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems

For ease of manufacture using standard process equipment, the printhead is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing. For color photographic applications, the printhead is 100 mm long, with a width which depends upon the ink jet type. The smallest printhead designed is covered in U.S. patent application Ser. No. 09/112,764, which is 0.35 mm wide, giving a chip area of 35 square mm. The printheads each contain 19,200 nozzles plus data and control circuitry.

Ink is supplied to the back of the printhead by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The printhead is connected to the camera circuitry by tape automated bonding.

Tables of Drop-on-Demand Ink Jets

Eleven important characteristics of the fundamental operation of individual ink jet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.

The following tables form the axes of an eleven dimensional table of ink jet types.

Actuator mechanism (18 types)

Basic operation mode (7 types)

Auxiliary mechanism (8 types)

Actuator amplification or modification method (17 types)

Actuator motion (19 types)

Nozzle refill method (4 types)

Method of restricting back-flow through inlet (10 types)

Nozzle clearing method (9 types)

Nozzle plate construction (9 types)

Drop ejection direction (5 types)

Ink type (7 types)

The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of ink jet nozzle. While not all of the possible combinations result in a viable ink jet technology, many million configurations are viable. It is clearly impractical to elucidate all of the possible configurations. Instead, certain ink jet types have been investigated in detail. Forty-five such inkjet types were filed simultaneously to the present application.

Other ink jet configurations can readily be derived from these forty-five examples by substituting alternative configurations along one or more of the 11 axes. Most of the forty-five examples can be made into ink jet printheads with characteristics superior to any currently available ink jet technology.

Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The simultaneously filed patent applications by the present applicant are listed by USSN numbers. In some cases, a print technology may be listed more than once in a table, where it shares characteristics with more than one entry.

Suitable applications for the ink jet technologies include: Home printers, Office network printers, Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.

The information associated with the aforementioned 11 dimensional matrix are set out in the following tables.

ACTUATOR MECHANISM (APPLIED ONLY TO SELECTED INK DROPS) Description Advantages Disadvantages Examples Thermal bubble An electrothermal Large force generated High power Canon Bubblejet 1979 heater heats the ink to Simple construction Ink carrier limited to Endo et al GB patent above boiling point, No moving parts water 2,007,162 transferring significant Fast operation Low efficiency Xerox heater-in-pit 1990 heat to the aqueous Small chip area High temperatures Hawkins et al U.S. Pat. ink. A bubble required for actuator required No. 4,899,181 nucleates and quickly High mechanical stress Hewlett-Packard TIJ forms, expelling the Unusual materials 1982 Vaught et al U.S. ink. The efficiency of required Pat. No. 4,490,728 the process is low, Large drive transistors with typically less than Cavitation causes 0.05% of the elctrical actuator failure energy being trans- Kogation reduces formed into kinetic bubble formation energy of the drop. Large print heads are difficult to fabricate Piezoelectric A piezoelectric crystal Low power Very large area Kyser et al U.S. Pat. No. such as lead lanthanum consumption required for actuator 3,946,398 zirconate (PZT) is Many ink types can be Difficult to integrate Zoltan U.S. Pat. No. electrically activated, used with electronics 3,683,212 and either expands, Fast operation High voltage drive 1973 Stemme U.S. Pat. shears, or bends to High efficiency transistors required No. 3,747,120 apply pressure to the Full pagewidth print Epson Stylus ink, ejecting drops. heads impractical due Tektronix to actuator size IJ04 Requires electrical poling in high field strengths during manufacture Electrostrictive An electric field is Low power Low maximum strain Seiko Epson, Usui et all used to activate consumption (approx. 0.01%) JP 253401/96 electrostriction in Many ink types can be Large area required IJ04 relaxor materials such used for actuator due to as lead lanthanum Low thermal low strain zirconate titanate expansion Response speed is (PLZT) or lead Electric field strength marginal (˜10 μs) magnesium niobate required (approx. 3.5 High voltage drive (PMN). V/μm) can be transistors required generated without Full pagewidth print difficulty heads impractical due Does not require to actuator size electrical poling Ferroelectric An electric field is Low power Difficult to integrate IJ04 used to induce a phase consumption with electronics transition between the Many ink types can be Unusual materials such antiferroelectric (AFE) used as PLZSnT are and ferroelectric (FE) Fast operation (<1 μs) required phase. Perovskite Relatively high Actuators require a materials such as tin longitudinal strain large area modified lead High efficiency lanthanum zirconate Electric field strength titanate (PLZSnT) of around 3 V/μm can exhibit large strains of be readily provided up to 1% associated with the AFE to FE phase transition. Electrostatic Conductive plates are Low power Difficult to operate IJ02, IJ04 plates separated by a com- consumption electrostatic devices in pressible or fluid Many ink types can be an aqueous environ- dielectric (usually air). used ment Upon application of a Fast operation The electrostatic voltage, the plates actuator will normally attract each other and need to be separated displace ink, causing from the ink drop ejection. The Very large area conductive plates may required to achieve be in a comb or honey- high forces comb structure, or High voltage drive stacked to increase the transistors may be surface area and there- required fore the force. Full pagewidth print heads are not competi- tive due to actuator size Electrostatic A strong electric field Low current High voltage required 1989 Saito et al, U.S. pull on ink is applied to the ink, consumption May be damaged by Pat. No. 4,799,068 whereupon electro- Low temperature sparks due to air 1989 Miura et al, U.S. static attraction breakdown Pat. No. 4,810,954 accelerates the ink Required field strength Tone-jet towards the print increases as the drop medium. size decreases High voltage drive transistors required Electrostatic field attracts dust Permanent An electromagnet Low power Complex fabrication IJ07, IJ10 magnet electro- directly attracts a consumption Permanent magnetic magnetic permanent magnet, Many ink types can be material such as displacing ink and used Neodymium Iron causing drop ejection. Fast operation Boron (NdFeB) Rare earth magnets High efficiency required. with a field strength Easy extension from High local currents around 1 Tesla can be single nozzles to required used. Examples are: pagewidth print heads Copper metalization Samarium Cobalt should be used for (SaCo) and magnetic long electromigration materials in the lifetime and low neodymium iron boron resistivity family (NdFeB, Pigmented inks are NdDyFeBNb, usually infeasible NdDyFeB, etc) Operating temperature limited to the Curie temperature (around 540 K.) Soft magnetic A solenoid induced a Low power Complex fabrication IJ01, IJ05, IJ08, IJ10, core electro- magnetic field in a soft consumption Materials not usually IJ12, IJ14, IJ15, IJ17 magnetic magnetic core or yoke Many ink types can be present in a CMOS fabricated from a used fab such as NiFe, ferrous material such Fast operation CoNiFe, or CoFe are as electroplated iron High efficiency required alloys such as CoNiFe Easy extension from High local currents [1], CoFe, or NiFe single nozzles to required alloys. Typically, the pagewidth print heads Copper metalization soft magnetic material should be used for is in two parts, which long electromigration are normally held apart lifetime and low by a spring. When the resistivity solenoid is actuated, Electroplating is the two parts attract, required displacing the ink. High saturation flux density is required (2.0-2.1 T is achiev- able with CoNiFe [1]) Lorenz force The Lorenz force Low power Force acts as a twist- IJ06, IJ11, IJ13, IJ16 acting on a current consumption ing motion carrying wire in a Many ink types can be Typically, only a magnetic field is used quarter of the solenoid utilized. This allows Fast operation length provides force the magnetic field to High efficiency in a useful direction be supplied externally Easy extension from High local currents to the print head, for single nozzles to required example with rare pagewidth print heads Copper metalization earth permanent should be used for magnets. Only the long electromigration current carrying wire lifetime and low need be fabricated on resistivity the printhead, Pigmented inks are simplifying materials usually infeasible requirements. Magneto- The actuator uses the Many ink types can be Force acts as a twist- Fischenbeck, U.S. Pat. striction giant magnetostrictive used ing motion No. 4,032,929 effect of materials Fast operation Unusual materials such IJ25 such as Terfenol-D (an Easy extension from as Terfenol-D are alloy of terbium, single nozzles to required dysprosium and iron pagewidth print heads High local currents developed at the Naval High force is available required Ordnance Laboratory, Copper metalization hence Ter-Fe-NOL). should be used for For best efficiency, the long electromigration actuator should be pre- lifetime and low stressed to approx. 8 resistivity MPa. Pre-stressing may be required Surface tension Ink under positive Low power Requires supple- Silverbrook, EP 0771 reduction pressure is held in a consumption mentary force to effect 658 A2 and related nozzle by surface Simple construction drop separation patent applications tension. The surface No unusual materials Requires special ink tension of the ink is required in fabrication surfactants reduced below the High efficiency Speed may be limited bubble threshold, Easy extension from by surfactant causing the ink to single nozzles to properties egress from the nozzle. pagewidth print heads Viscosity The ink viscosity is Simple construction Requires supple- Silverbrook, EP 0771 reduction locally reduced to No unusual materials mentary force to effect 658 A2 and related select which drops are required in fabrication drop separation patent applications to be ejected. A Easy extension from Requires special ink viscosity reduction can single nozzles to page- viscosity properties be achieved electro- width print heads High speed is difficult thermally with most to achieve inks, but special inks Requires oscillating can be engineered for ink pressure a 100:1 viscosity A high temperature reduction. difference (typically 80 degrees) is required Acoustic An acoustic wave is Can operate without a Complex drive cir- 1993 Hadimioglu et al, generated anf focussed nozzle plate cuitry EUP 550,192 upon the drop ejection Complex fabrication 1993 Elrod et al, EUP region. Low efficiency 572,220 Poor control of drop position Poor control of drop volume Thermoelastic An actuator which Low power Efficient aqueous IJ03, IJ09, IJ17, IJ18, bend actuator relies upon differential consumption operation requires a IJ19, IJ20, IJ21, IJ22, thermal expansion Many ink types can be thermal insulator on IJ23, IJ24, IJ27, IJ28, upon Joule heating is used the hot side IJ29, IJ30, IJ31, IJ32, used. Simple planar fabri- Corrosion prevention IJ33, IJ34, IJ35, IJ36, cation can be difficult IJ37, IJ38, IJ39, IJ40, Small chip area Pigmented inks may IJ41 required for each be infeasible, as actuator pigment particles may Fast operation jam the bend actuator High efficiency CMOS compatible voltages and currents Standard MEMS pro- cesses can be used Easy extension from single nozzles to pagewidth print heads High CTE A material with a very High force can be Requires special IJ09, IJ17, IJ18, IJ20, thermoelastic high coefficient of generated material (e.g. PTFE) IJ21, IJ22, IJ23, IJ24, actuator thermal expansion Three methods of Requires a PTFE IJ27, IJ28, IJ29, IJ30, (CTE) such as poly- PTFE deposition are deposition process, IJ31, IJ42, IJ43, IJ44 tetrafluoroethylene under development: which is not yet (PTFE) is used. As chemical vapor deposi- standard in ULSI fabs high CTE materials tion (CVD), spin PTFE deposition can- are usually non- coating, and evapora- not be followed with conductive, a heater tion high temperature fabricated from a PTFE is a candidate (above 350° C.) conductive material is for low dielectric processing incorporated. A 50 μm constant insulation in Pigmented inks may long PTFE bend ULSI be infeasible, as actuator with poly- Very low power pigment particles may silicon heater and consumption jam the bend actuator 15 mW power input Many ink types can be can provide 180 μN used force and 10 μm Simple planar deflection. Actuator fabrication motions include: Small chip area Bend required for each Push actuator Buckle Fast operation Rotate High efficiency CMOS compatible voltages and currents Easy extension from single nozzles to pagewidth print heads Conductive A polymer with a high High force can be Requires special IJ24 polymer coefficient of thermal generated materials development thermoelastic expansion (such as Very low power (High CTE conductive actuator PTFE) is doped with consumption polymer) conducting substances Many ink types can be Requires a PTFE to increase its con- used deposition process, ductivity to about 3 Simple planar which is not yet orders of magnitude fabrication standard in ULSI fabs below that of copper. Small chip area PTFE deposition can- The conducting poly- required for each not be followed with mer expands when actuator high temperature resistively heated. Fast operation (above 350° C.) Examples of conduct- High efficiency processing ing dopants include: CMOS compatible Evaporation and CVD Carbon nanotubes voltages and currents deposition techniques Metal fibers Easy extension from cannot be used Conductive polymers single nozzles to Pigmented inks may such as doped poly- pagewidth print heads be infeasible, as thiophene pigment particles may Carbon granules jam the bend actuator Shape memory A shape memory alloy High force is avail- Fatigue limits maxi- IJ26 alloy such as TiNi (also able (stresses of mum number of cycles known as Nitinol- hundreds of MPa) Low strain (1%) is Nickel Titanium alloy Large strain is avail- required to extend developed at the Naval able (more than 3%) fatigue resistance Ordnance Laboratory) High corrosion Cycle rate limited by is thermally switched resistance heat removal between its weak Simple construction Requires unusual martensitic state and Easy extension from materials (TiNi) its high stiffness single nozzles to The latent heat of austeic state. The pagewidth print heads transformation must shape of the actuator Low voltage operation be provided in its martensitic state High current operation is deformed relative to Requires prestressing the austenic shape. to distort the The shape change martensitic state causes ejection of a drop. Linear Linear magnetic Linear Magnetic Requires unusual IJ12 Magnetic actuators include the actuators can be semiconductor Actuator Linear Induction constructed with high materials such as Actuator (LIA), Linear thrust, long travel, soft magnetic alloys Permanent Magnet and high efficiency (e.g. CoNiFe) Synchronous Actuator using planar semi- Some varieties also (LPMSA), Linear conductor fabrication require permanent Reluctance techniques magnetic materials Synchronous Actuator Long actuator travel is such as Neodymium (LRSA), Linear available iron boron (NdFeB) Switched Reluctance Medium force is avail- Requires complex Actuator (LSRA), and able multi-phase drive the Linear Stepper Low voltage operation circuitry Actuator (LSA). High current operation

BASIC OPERATION MODE Description Advantages Disadvantages Examples Actuator This is the simplest Simple operation Drop repetition rate is Thermal ink jet directly pushes mode of operation: the No external fields Drop repetition rate is Thermal ink jet ink actuator directly required usually limited to Piezoelectric ink jet supplies sufficient Satellite drops can be around 10 kHz. How- IJ01, IJ02, IJ03, IJ04, kinetic energy to expel avoided if drop ever, this is not IJ05, IJ06, IJ07, IJ09, the drop. The drop velocity is less than fundamental to the IJ11, IJ12, IJ14, IJ16, must have a sufficient 4 m/s method, but is related IJ20, IJ22, IJ23, IJ24, velocity to overcome Can be efficient, to the refill method IJ25, IJ26, IJ27, IJ28, the surface tension. depending upon the normally used IJ29, IJ30, IJ31, IJ32, actuator used All of the drop kinetic IJ33, IJ34, IJ35, IJ36, energy must be pro- IJ37, IJ38, IJ39, IJ40, vided by the actuator IJ41, IJ42, IJ43, IJ44 Satellite drops usually form if drop velocity is greater than 4.5 m/s Proximity The drops to be print- Very simple print head Requires close Silverbrook, ESP 0771 ed are selected by fabrication can be used proximity between the 658 A2 and related some manner (e.g. The drop selection print head and the patent applications thermally induced means does not need print media or transfer surface tension reduc- to provide the energy roller tion of pressurized required to separate May require two print ink). Selected drops the drop from the heads printing alter- are separated from the nozzle nate rows of the image ink in the nozzle by Monolithic color print contact with the print heads are difficult medium or a transfer roller. Electrostatic The drops to be print- Very simple print head Requires very high Silverbrook, EP 0771 pull on ink ed are selected by fabrication can be used electrostatic field 658 A2 and related some manner (e.g. The drop selection Electrostatic field for patent applications thermally induced means does not need small nozzle sizes is Tone-Jet surface tension reduc- to provide the energy above air breakdown tion of pressurized required to separate Electrostatic field may ink). Selected drops the drop from the attract dust are separated from the nozzle ink in the nozzle by a strong electric field. Magnetic pull The drops to be print- Very simple print head Requires magnetic ink Silverbrook, EP 0771 on ink ed are selected by fabrication can be used Ink colors other than 658 A2 and related some manner (e.g. The drop selection black are difficult patent applications thermally induced means does not need Requires very high surface tension reduc- to provide the energy magnetic fields tion of pressurized required to separate ink). Selected drops the drop from the are separated from the nozzle ink in the nozzle by a strong magnetic field acting on the magnetic ink. Shutter The actuator moves a High speed (>50 kHz) Moving parts are IJ13, IJ17, IJ21 shutter to block in operation can be required flow to the nozzle. The achieved due to Requires ink pressure ink pressure is pulsed reduced refill time modulator at a multiple of the Drop timing can be Friction and wear drop ejection fre- very accurate must be considered quency. The actuator energy Stiction is possible can be very low Shuttered The actuator moves a Actuators with small Moving parts are IJ08, IJ15, IJ18, IJ19 grill shutter to block ink travel can be used required flow through a grill to Actuators with small Requires ink pressure the nozzle. The shutter force can be used modulator movement need only High speed (>50 kHz) Friction and wear must be equal to the width operation can be be considered of the grill holes. achieved Stiction is possible Pulsed A pulsed magnetic magnetic pull field attracts an ‘ink Extremely low energy Requires an external IJ10 on ink pusher pusher’ at the drop opeation is possible pulsed magnetic field ejection frequency. An No heat dissipation Requires special actuator controls a problems materials for both the catch, which prevents actuator and the ink the ink pusher from pusher moving when a drop is Complex construction not to be ejected.

AUXILIARY MECHANISM (APPLIED TO ALL NOZZLES) Description Advantages Disadvantages Examples None The actuator directly Simplicity of Drop ejection energy Most ink jets, including fires the ink drop, and construction must be supplied by piezoelectric and thermal there is no external Simplicity of individual nozzle bubble. field or other operation actuator IJ01, IJ02, IJ03, IJ04, mechanism required. Small physical size IJ05, IJ07, IJ09, IJ11, IJ12, IJ14, IJ20, IJ22, IJ23, IJ24, IJ25, IJ26, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ35, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Oscillating The ink pressure Oscillating ink Requires external ink Silverbrook, EP 0771 ink pressure oscillates, providing pressure can provide a pressure oscillator 658 A2 and related (including much of the drop refill pulse, allowing Ink pressure phase and patent applications acoustic ejection energy. The higher operating speed amplitude must be IJ08, IJ13, IJ15, IJ17, stimulation) actuator selectes which The actuators may carefully controlled IJ18, IJ19, IJ21 drops are to be fired operate with much Acoustic reflections by selectively blocking lower energy in the ink chamber or enabling nozzles. Acoustic lenses can be must be designed for The ink pressure used to focus the oscillation may be sound on the nozzles achieved by vibrating the print head, or preferably by an actuator in the ink supply. Media The print head is Low power Precision assembly Silverbrook, EP 0771 proximity placed in close High accuracy required 658 A2 and related proximity to the print Simple print head Paper fibers may cause patent applications medium. Selected construction problems drops protrude from Cannot print on rough the print head further substrates than unselected drops, and contact the print medium. The drop soaks into the medium fast enough to cause drop separation. Transfer roller Drops are printed to a High accuracy Bulky Silverbrook, EP 0771 transfer roller instead Wide range of print Expensive 658 A2 and related of straight to the print substrates can be used Complex construction patent applications medium. A transfer Ink can be dried on Tektronix hot melt roller can also be used the transfer roller piezoelectric ink jet for proximity drop Any of the IJ series separation. Electrostatic An electric field is Low power Field strength required Silverbrook, ESP 0771 used to accelerate Simple print head for separation of 658 A2 and related selected drops towards construction small drops is near or patent applications the print medium. above air breakdown Tone-Jet Direct A magnetic field is Low power Requires magnetic Silverbrook, ESP 0771 magnetic field used to accelerate Simple print head ink 658 A2 and related selected drops of construction Requires strong patent applications magnetic ink towards magnetic field the print medium. Cross magnetic The print head is Does not require Requires external IJ06, IJ16 field placed in a constant magnetic materials to magnet magnetic field. The be integrated in the Current densities may Lorenz force in a print head manufactur- be high, resulting in current carrying wire ing process electromigration is used to move the problems actuator. Pulsed A pulsed magnetic Very low power Complex print head IJ10 magnetic field field is used to operation is possible construction cyclically attract a Small print head size Magnetic materials paddle, which pushes required in print on the ink. A small head actuator moves a catch, which selectively prevents the paddle from moving.

ACTUATOR AMPLIFICATION OR MODIFICATION METHOD Description Advantages Disadvantages Examples None No actuator Operational Many actuator Thermal Bubble mechanical simplicity mechanisms have Ink jet amplification is used. insufficient travel, IJ01, IJ02, IJ06, The actuator directly or insufficient force, IJ07, IJ16, IJ25, drives the drop to efficiently drive IJ26 ejection process. the drop ejection process Differential An actuator material Provides greater High stresses are Piezoelectric expansion expands more on one travel in a reduced involved IJ03, IJ09, IJ17, bend side than on the other. print head area Care must be IJ18, IJ19, IJ20, actuator The expansion may be taken that the IJ21, IJ22, IJ23, thermal, piezoelectric, materials do not IJ24, IJ27, IJ29, magnetostrictive, or delaminate IJ30, IJ31, IJ32, other mechanism. The Residual bend IJ33, IJ34, IJ35, bend actuator converts resulting from high IJ36, IJ37, IJ38, a high force low travel temperature or high IJ39, IJ42, IJ43, actuator mechanism to stress during IJ44 high travel, lower formation force mechanism. Transient A trilayer bend Very good High stresses are IJ40, IJ41 bend actuator where the two temperature stability involved actuator outside layers are High speed, as a Care must be identical. This cancels new drop can be taken that the bend due to ambient fired before heat materials do not temperature and dissipates delaminate residual stress. The Cancels residual actuator only responds stress of formation to transient heating of one side or the other. Reverse The actuator loads a Better coupling Fabrication IJ05, IJ11 spring spring. When the to the ink complexity actuator is turned off, High stress in the the spring releases. spring This can reverse the force/distance curve of the actuator to make it compatible with the force/time requirements of the drop ejection. Actuator A series of thin Increased travel Increased Some stack actuators are stacked. Reduced drive fabrication piezoelectric ink jets This can be voltage complexity IJ04 appropriate where Increased actuators require high possibility of short electric field strength, circuits due to such as electrostatic pinholes and piezoelectric actuators. Multiple Multiple smaller Increases the Actuator forces IJ12, IJ13, IJ18, actuators actuators are used force available from may not add IJ20, IJ22, IJ28, simultaneously to an actuator linearly, reducing IJ42, IJ43 move the ink. Each Multiple efficiency actuator need provide actuators can be only a portion of the positioned to control force required. ink flow accurately Linear A linear spring is used Matches low Requires print IJ15 Spring to transform a motion travel actuator with head area for the with small travel and higher travel spring high force into a requirements longer travel, lower Non-contact force motion. method of motion transformation Coiled A bend actuator is Increases travel Generally IJ17, IJ21, IJ34, actuator coiled to provide Reduces chip restricted to planar IJ35 greater travel in a area implementations reduced chip area. Planar due to extreme implementations are fabrication difficulty relatively easy to in other orientations. fabricate. Flexure A bend actuator has a Simple means of Care must be IJ10, IJ19, IJ33 bend small region near the increasing travel of taken not to exceed actuator fixture point, which a bend actuator the elastic limit in flexes much more the flexure area readily than the Stress remainder of the distribution is very actuator. The actuator uneven flexing is effectively Difficult to converted from an accurately model even coiling to an with finite element angular bend, resulting analysis in greater travel of the actuator tip. Catch The actuator controls a Very low Complex IJ10 small catch. The catch actuator energy construction either enables or Very small Requires external disables movement of actuator size force an ink pusher that is Unsuitable for controlled in a bulk pigmented inks manner. Gears Gears can be used to Low force, low Moving parts are IJ13 increase travel at the travel actuators can required expense of duration. be used Several actuator Circular gears, rack Can be fabricated cycles are required and pinion, ratchets, using standard More complex and other gearing, surface MEMS drive electronics methods can be used. processes Complex construction Friction, friction, and wear are possible Buckle plate A buckle plate can be Very fast Must stay within S. Hirata et al, used to change a slow movement elastic limits of the “An Ink-jet Head actuator into a fast achievable materials for long Using Diaphragm motion. It can also device life Microactuator”, convert a high force, High stresses Proc. IEEE MEMS, low travel actuator involved Feb. 1996, pp 418- into a high travel, Generally high 423. medium force motion. power requirement IJ18, IJ27 Tapered A tapered magnetic Linearizes the Complex IJ14 magnetic pole can increase magnetic construction pole travel at the expense force/distance curve of force. Lever A lever and fulcrum is Matches low High stress IJ32, IJ36, IJ37 used to transform a travel actuator with around the fulcrum motion with small higher travel travel and high force requirements into a motion with Fulcrum area has longer travel and no linear movement, lower force. The lever and can be used for can also reverse the a fluid seal direction of travel. Rotary The actuator is High mechanical Complex IJ28 impeller connected to a rotary advantage construction impeller. A small The ratio of force Unsuitable for angular deflection of to travel of the pigmented inks the actuator results in actuator can be a rotation of the matched to the impeller vanes, which nozzle requirements push the ink against by varying the stationary vanes and number of impeller out of the nozzle. vanes Acoustic A refractive or No moving parts Large area 1993 Hadimioglu lens diffractive (e.g. zone required et al, EUP 550,192 plate) acoustic lens is Only relevant for 1993 Elrod et al, used to concentrate acoustic ink jets EUP 572,220 sound waves. Sharp A sharp point is used Simple Difficult to Tone-jet conductive to concentrate an construction fabricate using point electrostatic field. standard VLSI processes for a surface ejecting ink- jet Only relevant for electrostatic ink jets

ACTUATOR MOTION Description Advantages Disadvantages Examples Volume The volume of the Simple High energy is Hewlett-Packard expansion actuator changes, construction in the typically required to Thermal Ink jet pushing the ink in all case of thermal ink achieve volume Canon Bubblejet directions. jet expansion. This leads to thermal stress, cavitation, and kogation in thermal ink jet implementations Linear, The actuator moves in Efficient High fabrication IJ01, IJ02, IJ04, normal to a direction normal to coupling to ink complexity may be IJ07, IJ11, IJ14 chip surface the print head surface. drops ejected required to achieve The nozzle is typically normal to the perpendicular in the line of surface motion movement. Parallel to The actuator moves Suitable for Fabrication IJ12, IJ13, IJ15, chip surface parallel to the print planar fabrication complexity IJ33,, IJ34, IJ35, head surface. Drop Friction IJ36 ejection may still be Stiction normal to the surface. Membrane An actuator with a The effective Fabrication 1982 Howkins push high force but small area of the actuator complexity U.S. Pat. No. 4,459,601 area is used to push a becomes the Actuator size stiff membrane that is membrane area Difficulty of in contact with the ink. integration in a VLSI process Rotary The actuator causes Rotary levers Device IJ05, IJ08, IJ13, the rotation of some may be used to complexity IJ28 element, such a grill or increase travel May have impeller Small chip area friction at a pivot requirements point Bend The actuator bends A very small Requires the 1970 Kyser et al when energized. This change in actuator to be made U.S. Pat. No. 3,946,398 may be due to dimensions can be from at least two 1973 Stemme differential thermal converted to a large distinct layers, or to U.S. Pat. No. 3,747,120 expansion, motion. have a thermal IJ03, IJ09, IJ10, piezoelectric difference across the IJ19, IJ23, IJ24, expansion, actuator IJ25, IJ29, IJ30, magnetostriction, or IJ31, IJ33, IJ34, other form of relative IJ35 dimensional change. Swivel The actuator swivels Allows operation Inefficient IJ06 around a central pivot. where the net linear coupling to the ink This motion is suitable force on the paddle motion where there are is zero opposite forces Small chip area applied to opposite requirements sides of the paddle, e.g. Lorenz force. Straighten The actuator is Can be used with Requires careful IJ26, IJ32 normally bent, and shape memory balance of stresses straightens when alloys where the to ensure that the energized. austenic phase is quiescent bend is planar accurate Double The actuator bends in One actuator can Difficult to make IJ36, IJ37, IJ38 bend one direction when be used to power the drops ejected by one element is two nozzles. both bend directions energized, and bends Reduced chip identical. the other way when size. A small another element is Not sensitive to efficiency loss energized. ambient temperature compared to equivalent single bend actuators. Shear Energizing the Can increase the Not readily 1985 Fishbeck actuator causes a shear effective travel of applicable to other U.S. Pat. No. 4,584,590 motion in the actuator piezoelectric actuator material. actuators. mechanisms Radial con- The actuator squeezes Relatively easy High force 1970 Zoltan striction an ink reservoir, to fabricate single required U.S. Pat. No. 3,683,212 forcing ink from a nozzles from glass Inefficient constricted nozzle. tubing as Difficult to macroscopic integrate with VLSI structures processes Coil/uncoil A coiled actuator Easy to fabricate Difficult to IJ17, IJ21, IJ34, uncoils or coils more as a planar VLSI fabricate for non- IJ35 tightly. The motion of process planar devices the free end of the Small area Poor out-of-plane actuator ejects the ink. required, therefore stiffness low cost Bow The actuator bows (or Can increase the Maximum travel IJ16, IJ18, IJ27 buckles) in the middle speed of travel is constrained when energized. Mechanically High force rigid required Push-Pull Two actuators control The structure is Not readily IJ18 a shutter. One actuator pinned at both ends, suitable for ink jets pulls the shutter, and so has a high out-of- which directly push the other pushes it. plane rigidity the ink Curl A set of actuators curl Good fluid flow Design IJ20, IJ42 inwards inwards to reduce the to the region behind complexity volume of ink that the actuator they enclose. increases efficiency Curl A set of actuators curl Relatively simple Relatively large IJ43 outwards outwards, pressurizing construction chip area ink in a chamber surrounding the actuators, and expelling ink from a nozzle in the chamber. Iris Multiple vanes enclose High efficiency High fabrication IJ22 a volume of ink. These Small chip area complexity simultaneously rotate, Not suitable for reducing the volume pigmented inks between the vanes. Acoustic The actuator vibrates The actuator can Large area 1993 Hadimioglu vibration at a high frequency. be physically distant required for et al, EUP 550,192 from the ink efficient operation 1993 Elrod et al, at useful frequencies EUP 572,220 Acoustic coupling and crosstalk Complex drive circuitry Poor control of drop volume and position None In various ink jet No moving parts Various other Silverbrook, EP designs the actuator tradeoffs are 0771 658 A2 and does not move. required to related patent eliminate moving applications parts Tone-jet

NOZZLE REFILL METHOD Description Advantages Disadvantages Examples Surface This is the normal way Fabrication Low speed Thermal ink jet tension that ink jets are simplicity Surface tension Piezoelectric ink refilled. After the Operational force relatively jet actuator is energized, simplicity small compared to IJ01-IJ07, IJ10- it typically returns actuator force IJ14, IJ16, IJ20, rapidly to its normal Long refill time IJ22-IJ45 position. This rapid usually dominates return sucks in air the total repetition through the nozzle rate opening. The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area. This force refills the nozzle. Shuttered Ink to the nozzle High speed Requires IJ08, IJ13, IJ15, oscillating chamber is provided at Low actuator common ink IJ17, IJ18, IJ19, ink pressure a pressure that energy, as the pressure oscillator IJ21 oscillates at twice the actuator need only May not be drop ejection open or close the suitable for frequency. When a shutter, instead of pigmented inks drop is to be ejected, ejecting the ink drop the shutter is opened for 3 half cycles: drop ejection, actuator return, and refill. The shutter is then closed to prevent the nozzle chamber emptying during the next negative pressure cycle. Refill After the main High speed, as Requires two IJ09 actuator actuator has ejected a the nozzle is independent drop a second (refill) actively refilled actuators per nozzle actuator is energized. The refill actuator pushes ink into the nozzle chamber. The refill actuator returns slowly, to prevent its return from emptying the chamber again. Positive ink The ink is held a slight High refill rate, Surface spill Silverbrook, EP pressure positive pressure. therefore a high must be prevented 0771 658 A2 and After the ink drop is drop repetition rate Highly related patent ejected, the nozzle is possible hydrophobic print applications chamber fills quickly head surfaces are Alternative for:, as surface tension and required IJ01-IJ07, IJ10-IJ14, ink pressure both IJ16, IJ20, IJ22-IJ45 operate to refill the nozzle.

METHOD OF RESTRICTING BACK-FLOW THROUGH INLET Description Advantages Disadvantages Examples Long inlet The ink inlet channel Design simplicity Restricts refill Thermal ink jet channel to the nozzle chamber Operational rate Piezoelectric ink is made long and simplicity May result in a jet relatively narrow, Reduces relatively large chip IJ42, IJ43 relying on viscous crosstalk area drag to reduce inlet Only partially back-flow. effective Positive ink The ink is under a Drop selection Requires a Silverbrook, EP pressure positive pressure, so and separation method (such as a 0771 658 A2 and that in the quiescent forces can be nozzle rim or related patent state some of the ink reduced effective applications drop already protrudes Fast refill time hydrophobizing, or Possible from the nozzle. both) to prevent operation of the This reduces the flooding of the following: IJ01- pressure in the nozzle ejection surface of IJ07, IJ09-IJ12, chamber which is the print head. IJ14, IJ16, IJ20, required to eject a IJ22, IJ23-IJ34, certain volume of ink. IJ36-IJ41, IJ44 The reduction in chamber pressure results in a reduction in ink pushed out through the inlet. Baffle One or more baffles The refill rate is Design HP Thermal Ink are placed in the inlet not as restricted as complexity Jet ink flow. When the the long inlet May increase Tektronix actuator is energized, method. fabrication piezoelectric ink jet the rapid ink Reduces complexity (e.g. movement creates crosstalk Tektronix hot melt eddies which restrict Piezoelectric print the flow through the heads). inlet. The slower refill process is unrestricted, and does not result in eddies. Flexible flap In this method recently Significantly Not applicable to Canon restricts disclosed by Canon, reduces back-flow most ink jet inlet the expanding actuator for edge-shooter configurations (bubble) pushes on a thermal ink jet Increased flexible flap that devices fabrication restricts the inlet. complexity Inelastic deformation of polymer flap results in creep over extended use Inlet filter A filter is located Additional Restricts refill IJ04, IJ12, IJ24, between the ink inlet advantage of ink rate IJ27, IJ29, IJ30 and the nozzle filtration May result in chamber. The filter Ink filter may be complex has a multitude of fabricated with no construction small holes or slots, additional process restricting ink flow. steps The filter also removes particles which may block the nozzle. Small inlet The ink inlet channel Design simplicity Restricts refill IJ02, IJ37, IJ44 compared to the nozzle chamber rate to nozzle has a substantially May result in a smaller cross section relatively large chip than that of the nozzle, area resulting in easier ink Only partially egress out of the effective nozzle than out of the inlet. Inlet shutter A secondary actuator Increases speed Requires separate IJ09 controls the position of of the ink-jet print refill actuator and a shutter, closing off head operation drive circuit the ink inlet when the main actuator is energized. The inlet is The method avoids the Back-flow Requires careful IJ01, IJ03, IJ05, located problem of inlet back- problem is design to minimize IJ06, IJ07, IJ10, behind the flow by arranging the eliminated the negative IJ11, IJ14, IJ16, ink-pushing ink-pushing surface of pressure behind the IJ22, IJ23, IJ25, surface the actuator between paddle IJ28, IJ31, IJ32, the inlet and the IJ33, IJ34, IJ35, nozzle. IJ36, IJ39, IJ40, IJ41 Part of the The actuator and a Significant Small increase in IJ07, IJ20, IJ26, actuator wall of the ink reductions in back- fabrication IJ38 moves to chamber are arranged flow can be complexity shut off the so that the motion of achieved inlet the actuator closes off Compact designs the inlet. possible Nozzle In some configurations Ink back-flow None related to Silverbrook, EP actuator of ink jet, there is no problem is ink back-flow on 0771 658 A2 and does not expansion or eliminated actuation related patent result in ink movement of an applications back-flow actuator which may Valve-jet cause ink back-flow Tone-jet through the inlet.

NOZZLE CLEARING METHOD Description Advantages Disadvantages Examples Normal All of the nozzles are No added May not be Most ink jet nozzle firing fired periodically, complexity on the sufficient to systems before the ink has a print head displace dried ink IJ01, IJ02, IJ03, chance to dry. When IJ04, IJ05, IJ06, not in use the nozzles IJ07, IJ09, IJ10, are sealed (capped) IJ11, IJ12, IJ14, against air. IJ16, IJ20, IJ22, The nozzle firing is IJ23, IJ24, IJ25, usually performed IJ26, IJ27, IJ28, during a special IJ29, IJ30, IJ31, clearing cycle, after IJ32, IJ33, IJ34, first moving the print IJ36, IJ37, IJ38, head to a cleaning IJ39, IJ40,, IJ41, station. IJ42, IJ43, IJ44,, IJ45 Extra In systems which heat Can be highly Requires higher Silverbrook, EP power to the ink, but do not boil effective if the drive voltage for 0771 658 A2 and ink heater it under normal heater is adjacent to clearing related patent situations, nozzle the nozzle May require applications clearing can be larger drive achieved by over- transistors powering the heater and boiling ink at the nozzle. Rapid The actuator is fired in Does not require Effectiveness May be used success-ion rapid succession. In extra drive circuits depends with: IJ01, IJ02, of actuator some configurations, on the print head substantially upon IJ03, IJ04, IJ05, pulses this may cause heat Can be readily the configuration of IJ06, IJ07, IJ09, build-up at the nozzle controlled and the ink jet nozzle IJ10, IJ11, IJ14, which boils the ink, initiated by digital IJ16, IJ20, IJ22, clearing the nozzle. In logic IJ23, IJ24, IJ25, other situations, it may IJ27, IJ28, IJ29, cause sufficient IJ30, IJ31, IJ32, vibrations to dislodge IJ33, IJ34, IJ36, clogged nozzles. IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44, IJ45 Extra Where an actuator is A simple Not suitable May be used power to not normally driven to solution where where there is a with: IJ03, IJ09, ink pushing the limit of its motion, applicable hard limit to IJ16, IJ20, IJ23, actuator nozzle clearing may be actuator movement IJ24, IJ25, IJ27, assisted by providing IJ29, IJ30, IJ31, an enhanced drive IJ32, IJ39, IJ40, signal to the actuator. IJ41, IJ42, IJ43, IJ44, IJ45 Acoustic An ultrasonic wave is A high nozzle High IJ08, IJ13, IJ15, resonance applied to the ink clearing capability implementation cost IJ17, IJ18, IJ19, chamber. This wave is can be achieved if system does not IJ21 of an appropriate May be already include an amplitude and implemented at very acoustic actuator frequency to cause low cost in systems sufficient force at the which already nozzle to clear include acoustic blockages. This is actuators easiest to achieve if the ultrasonic wave is at a resonant frequency of the ink cavity. Nozzle A microfabricated Can clear Accurate Silverbrook, EP clearing plate is pushed against severely clogged mechanical 0771 658 A2 and plate the nozzles. The plate nozzles alignment is related patent has a post for every required applications nozzle. A post moves Moving parts are through each nozzle, required displacing dried ink. There is risk of damage to the nozzles Accurate fabrication is required Ink The pressure of the ink May be effective Requires May be used pressure is temporarily where other pressure pump or with all IJ series ink pulse increased so that ink methods cannot be other pressure jets streams from all of the used actuator nozzles. This may be Expensive used in conjunction Wasteful of ink with actuator energizing. Print head A flexible ‘blade’ is Effective for Difficult to use if Many ink jet wiper wiped across the print planar print head print head surface is systems head surface. The surfaces non-planar or very blade is usually Low cost fragile fabricated from a Requires flexible polymer, e.g. mechanical parts rubber or synthetic Blade can wear elastomer. out in high volume print systems Separate A separate heater is Can be effective Fabrication Can be used with ink boiling provided at the nozzle where other nozzle complexity many IJ series ink heater although the normal clearing methods jets drop e-ection cannot be used mechanism does not Can be require it. The heaters implemented at no do not require additional cost in individual drive some ink jet circuits, as many configurations nozzles can be cleared simultaneously, and no imaging is required.

NOZZLE PLATE CONSTRUCTION Description Advantages Disadvantages Examples Electro- A nozzle plate is Fabrication High Hewlett Packard formed separately fabricated simplicity temperatures and Thermal Ink jet nickel from electroformed pressures are nickel, and bonded to required to bond the print head chip. nozzle plate Minimum thickness constraints Differential thermal expansion Laser Individual nozzle No masks Each hole must Canon Bubblejet ablated or holes are ablated by an required be individually 1988 Sercel et drilled intense UV laser in a Can be quite fast formed al., SPIE, Vol. 998 polymer nozzle plate, which is Some control Special Excimer Beam typically a polymer over nozzle profile equipment required Applications, pp. such as polyimide or is possible Slow where there 76-83 polysulphone Equipment are many thousands 1993 Watanabe required is relatively of nozzles per print et al., U.S. Pat. No. low cost head 5,208,604 May produce thin burrs at exit holes Silicon A separate nozzle High accuracy is Two part K. Bean, IEEE micro- plate is attainable construction Transactions on machined micromachined from High cost Electron Devices, single crystal silicon, Requires Vol. ED-25, No. 10, and bonded to the precision alignment 1978, pp 1185-1195 print head wafer. Nozzles may be Xerox 1990 clogged by adhesive Hawkins et al., U.S. Pat. No. 4,899,181 Glass Fine glass capillaries No expensive Very small 1970 Zoltan capillaries are drawn from glass equipment required nozzle sizes are U.S. Pat. No. 3,683,212 tubing. This method Simple to make difficult to form has been used for single nozzles Not suited for making individual mass production nozzles, but is difficult to use for bulk manufacturing of print heads with thousands of nozzles. Monolithic, The nozzle plate is High accuracy Requires Silverbrook, EP surface deposited as a layer (<1 μm) sacrificial layer 0771 658 A2 and micro- using standard VLSI Monolithic under the nozzle related patent machined deposition techniques. Low cost plate to form the applications using VLSI Nozzles are etched in Existing nozzle chamber IJ01, IJ02, IJ04, litho- the nozzle plate using processes can be Surface may be IJ11, IJ12, IJ17, graphic VLSI lithography and used fragile to the touch IJ18, IJ20, IJ22, processes etching. IJ24, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Monolithic, The nozzle plate is a High accuracy Requires long IJ03, IJ05, IJ06, etched buried etch stop in the (<1 μm) etch times IJ07, IJ08, IJ09, through wafer. Nozzle Monolithic Requires a IJ10, IJ13, IJ14, substrate chambers are etched in Low cost support wafer IJ15, IJ16, IJ19, the front of the wafer, No differential IJ21, IJ23, IJ25, and the wafer is expansion IJ26 thinned from the back side. Nozzles are then etched in the etch stop layer. No nozzle Various methods have No nozzles to Difficult to Ricoh 1995 plate been tried to eliminate become clogged control drop Sekiya et al the nozzles entirely, to position accurately U.S. Pat. No. 5,412,413 prevent nozzle Crosstalk 1993 Hadimioglu clogging. These problems et al EUP 550,192 include thermal bubble 1993 Elrod et al mechanisms and EUP 572,220 acoustic lens mechanisms Trough Each drop ejector has Reduced Drop firing IJ35 a trough through manufacturing direction is sensitive which a paddle moves. complexity to wicking. There is no nozzle Monolithic plate. Nozzle slit The elimination of No nozzles to Difficult to 1989 Saito et al instead of nozzle holes and become clogged control drop U.S. Pat. No. 4,799,068 individual replacement by a slit position accurately nozzles encompassing many Crosstalk actuator positions problems reduces nozzle clogging, but increases crosstalk due to ink surface waves

DROP EJECTION DIRECTION Description Advantages Disadvantages Examples Edge Ink flow is along the Simple Nozzles limited Canon Bubblejet (‘edge surface of the chip, construction to edge 1979 Endo et al GB shooter’) and ink drops are No silicon High resolution patent 2,007,162 ejected from the chip etching required is difficult Xerox heater-in- edge. Good heat Fast color pit 1990 Hawkins et al sinking via substrate printing requires U.S. Pat. No. 4,899,181 Mechanically one print head per Tone-jet strong color Ease of chip handing Surface Ink flow is along the No bulk silicon Maximum ink Hewlett-Packard (‘roof surface of the chip, etching required flow is severely TIJ 1982 Vaught et al shooter’) and ink drops are Silicon can make restricted U.S. Pat. No. 4,490,728 ejected from the chip an effective heat IJ02, IJ11, IJ12, surface, normal to the sink IJ20, IJ22 plane of the chip. Mechanical strength Through Ink flow is through the High ink flow Requires bulk Silverbrook, EP chip, chip, and ink drops are Suitable for silicon etching 0771 658 A2 and forward ejected from the front pagewidth print related patent (‘up surface of the chip. heads applications shooter’) High nozzle IJ04, IJ17, IJ18, packing density IJ24, IJ27-IJ45 therefore low manufacturing cost Through Ink flow is through the High ink flow Requires wafer IJ01, IJ03, IJ05, chip, chip, and ink drops are Suitable for thinning IJ06, IJ07, IJ08, reverse ejected from the rear pagewidth print Requires special IJ09, IJ10, IJ13, (‘down surface of the chip. heads handling during IJ14, IJ15, IJ16, shooter’) High nozzle manufacture IJ19, IJ21, IJ23, packing density IJ25, IJ26 therefore low manufacturing cost Through Ink flow is through the Suitable for Pagewidth print Epson Stylus actuator actuator, which is not piezoelectric print heads require Tektronix hot fabricated as part of heads several thousand melt piezoelectric the same substrate as connections to drive ink jets the drive transistors. circuits Cannot be manufactured in standard CMOS fabs Complex assembly required

INK TYPE Description Advantages Disadvantages Examples Aqueous, Water based ink which Environmentally Slow drying Most existing ink dye typically contains: friendly Corrosive jets water, dye, surfactant, No odor Bleeds on paper All IJ series ink humectant, and May jets biocide. strikethrough Silverbrook, EP Modern ink dyes have Cockles paper 0771 658 A2 and high water-fastness, related patent light fastness applications Aqueous, Water based ink which Environmentally Slow drying IJ02, IJ04, IJ21, pigment typically contains: friendly Corrosive IJ26, IJ27, IJ30 water, pigment, No odor Pigment may Silverbrook, EP surfactant, humectant, Reduced bleed clog nozzles 0771 658 A2 and and biocide. Reduced wicking Pigment may related patent Pigments have an Reduced clog actuator applications advantage in reduced strikethrough mechanisms Piezoelectric ink- bleed, wicking and Cockles paper jets strikethrough. Thermal ink jets (with significant restrictions) Methyl MEK is a highly Very fast drying Odorous All IJ series ink Ethyl volatile solvent used Prints on various Flammable jets Ketone for industrial printing substrates such as (MEK) on difficult surfaces metals and plastics such as aluminum cans. Alcohol Alcohol based inks Fast drying Slight odor All IJ series ink (ethanol, 2- can be used where the Operates at sub- Flammable jets butanol, printer must operate at freezing and others) temperatures below temperatures the freezing point of Reduced paper water. An example of cockle this is in-camera Low cost consumer photographic printing. Phase The ink is solid at No drying time- High viscosity Tektronix hot change room temperature, and ink instantly freezes Printed ink melt piezoelectric (hot melt) is melted in the print on the print medium typically has a ink jets head before jetting. Almost any print ‘waxy’ feel 1989 Nowak Hot melt inks are medium can be used Printed pages U.S. Pat. No. 4,820,346 usually wax based, No paper cockle may ‘block’ All IJ series ink with a melting point occurs Ink temperature jets around 80° C. After No wicking may be above the jetting the ink freezes occurs curie point of almost instantly upon No bleed occurs permanent magnets contacting the print No strikethrough Ink heaters medium or a transfer occurs consume power roller. Longwarm-up time Oil Oil based inks are High solubility High viscosity: All IJ series ink extensively used in medium for some this is a significant jets offset printing. They dyes limitation for use in have advantages in Does not cockle ink jets, which improved paper usually require a characteristics on Does not wick low viscosity. Some paper (especially no through paper short chain and wicking or cockle). multi-branched oils Oil soluble dies and have a sufficiently pigments are required. low viscosity. Slow drying Micro- A microemulsion is a Stops ink bleed Viscosity higher All IJ series ink emulsion stable, self forming High dye than water jets emulsion of oil, water, solubility Cost is slightly and surfactant. The Water, oil, and higher than water characteristic drop size amphiphilic soluble based ink is less than 100 nm, dies can be used High surfactant and is determined by Can stabilize concentration the preferred curvature pigment required (around of the surfactant. suspensions 5%) 

What is claimed is:
 1. A method of manufacture of an ink jet printhead which includes a nozzle chamber having at least two fluid ejection apertures defined in a roof of the chamber; a moveable paddle vane located in a region of a first one of the fluid ejection apertures; an actuator mechanism attached to the moveable paddle vane and adapted to move the paddle vane in a first direction so as to cause the ejection of fluid drops out of the first fluid ejection aperture and to further move the paddle vane in a second, alternative direction so as to cause the ejection of fluid drops out of a second fluid ejection aperture, the method comprising the steps of: (a) initially providing a silicon wafer having a circuitry wafer layer including electrical circuitry necessary for the operation of the actuator mechanism on demand; (b) etching a trough in the wafer to provide for an ink supply channel through a portion of the wafer; (c) creating the nozzle chamber, the actuator mechanism and the paddle vane within the nozzle chamber on the silicon wafer by means of depositing and etching a series of sacrificial layers to form a supporting structure for the nozzle chamber, the actuator mechanism and the paddle vane, in addition to depositing and suitably etching a series of materials for forming the nozzle chamber including a pair of fluid ejection apertures in a roof of the nozzle chamber, the actuator mechanism and the paddle vane; (d) etching an ink inlet in the wafer, the inlet being in communication with the nozzle chamber via the ink supply channel extending through the wafer; and (e) etching away any remaining sacrificial layers so as to release the actuator mechanism and said paddle vane such that the paddle vane is displaceable relative to the fluid ejection apertures for effecting ink ejection from one of the apertures at a time on demand.
 2. A method as claimed in claim 1 wherein step (c) comprises the steps of: (i) depositing and etching a first series of sacrificial layers to form a first supporting structure; (ii) depositing and etching a first non-conductive material layer to form a first structure including a portion of the nozzle chamber and a first portion of the actuator mechanism; (iii) depositing and etching a first conductive material layer to form a lower heater structure of the actuator mechanism; (iv) depositing and etching a second non-conductive material layer forming a central portion of the actuator mechanism, a portion of the nozzle wall and the paddle vane in addition to a supporting structure for an upper heater structure; (v) depositing and etching a second conductive material layer to form an upper heater structure of the actuator mechanism; (vi) depositing and etching a further, third non-conductive material layer so as to form the paddle vane, the nozzle chamber walls and a portion affixing one end of the actuator mechanism to the wafer; (vii) depositing and etching a further sacrificial layer to form a further supporting structure for the nozzle chamber walls; and (viii) depositing and etching a further, fourth non-conductive material layer forming the nozzle chamber walls and roof in addition to the fluid ejection apertures.
 3. A method as claimed in claim 2 wherein the first and second conductive material comprises substantially a copper nickel alloy.
 4. A method as claimed in claim 2 wherein the non-conductive material comprises substantially silicon dioxide.
 5. A method as claimed in claim 1 wherein the sacrificial layers comprise substantially glass and/or aluminum.
 6. A method as claimed in claim 1 further including the step of depositing corrosion barriers over portions of said arrangement so as to reduce corrosion effects.
 7. A method as claimed in claim 1 wherein said wafer comprises a double sided polished CMOS wafer.
 8. A method as claimed in claim 1 wherein at least step (e) is also utilized to simultaneously separate said wafer into separate printheads. 